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Red Copper Plate Sheet 0.3mm 0.5mm 08mm Thickness Pure Copper Plate Used for laptop cooling
High-Performance Pure Copper Shims for Laptop Cooling Solve laptop overheating permanently with SLAST's 99.9% pure red copper shims. With exceptional 401W/mK thermal conductivity, these flexible sheets effectively solve CPU/GPU overheating issues, prevent system crashes, and extend device lifespan. Key Benefits Eliminate Overheating: Directly replaces inefficient thermal pads/plastics Maximize Performance: Prevents CPU/GPU thermal throttling for consistent speed Long-Term
Detalhes do produto
Destacar:
0.3mm pure copper plate for laptop cooling
,0.5mm red copper sheet with high thermal conductivity
,0.8mm thickness copper plate for electronics cooling
Material:
Red Copper
Size:
15*15/20*20
Thickness:
0,1/0,3mm/0,5mm//0,8mm/1mm/1,2mm/1,5mm /2,0mm
Type:
Perfis de extrusão de dissipador de calor OEM
MOQ:
100
Customized:
aceito
Rated Voltage:
10 quilovolts
Application:
alta temperatura
Propriedades básicas
Lugar de origem:
Jiangsu, China
Nome da marca:
Wuxi Slast/Sylaith Special Steel Co., LTD
Certificação:
MTC
Número do Modelo:
T1 T2 T3 C11000 C11100 C11300 C11400 C11500 C1100
Propriedades comerciais
Quantidade mínima do pedido:
100kg
Condições de Pagamento:
30% TT DEPÓSITO ANTEMENTAL 70% BALANCO DE TT ANTES DO LOADING
Capacidade de fornecimento:
1000+ toneladas/toneladas+mês
Descrição do produto
High-Performance Pure Copper Shims for Laptop Cooling
Solve laptop overheating permanently with SLAST's 99.9% pure red copper shims. With exceptional 401W/mK thermal conductivity, these flexible sheets effectively solve CPU/GPU overheating issues, prevent system crashes, and extend device lifespan.
Key Benefits
- Eliminate Overheating: Directly replaces inefficient thermal pads/plastics
- Maximize Performance: Prevents CPU/GPU thermal throttling for consistent speed
- Long-Term Reliability: Copper does not degrade over time, unlike pastes and pads
- Perfect Fit: Soft and flexible for excellent surface conformity
- Easy Installation: Naturally tacky surface holds in place during assembly
Product Specifications
| Attribute | Details |
|---|---|
| Brand Name | SLAST |
| Material | 99.9% Pure Red Copper (Cu ≥99.9%) |
| Thermal Conductivity | 401 W/mK |
| Available Sizes | 15mm x 15mm, 20mm x 20mm (Custom sizes accepted) |
| Available Thickness | 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 1.8mm, 2.0mm |
| Key Feature | High Compressibility, Soft, Flexible, No Adhesive Needed |
| Application | Laptop CPU/GPU Cooling, Electronics Heat Dissipation |
| Place of Origin | Jiangsu, China |
| MOQ | 100 Pcs |
Applications
- Laptop Repair & Maintenance: Perfect for replacing thermal interfaces on laptop CPUs and GPUs
- Gaming Laptops: Maintain stable GPU and CPU temperatures during intense gaming
- Workstations: Manage heat from sustained high computational loads in video editing and CAD
- General Electronics: Effective for cooling hotspots in devices like Raspberry Pi and game consoles
- DIY Projects: Excellent thermal interface for custom cooling solutions
How It Works
The pure copper shim creates an efficient thermal bridge between your laptop's heat-generating components (CPU/GPU) and the heatsink. Copper's exceptional 401W/mK conductivity rapidly transfers heat away from components, preventing thermal throttling and maintaining optimal performance.
Packing and Shipping
Frequently Asked Questions
Q1: Do these copper shims require thermal paste?
A: Yes, we recommend using high-quality thermal paste on both sides of the copper shim for optimal thermal contact.
Q2: How do I install the copper shim?
A: 1. Clean CPU/GPU and heatsink surfaces. 2. Place copper shim on chip. 3. Apply thermal paste to shim top. 4. Reinstall heatsink with even pressure.
Q3: Can I get a custom size or shape?
A: Yes, we accept customized orders. Contact us with your requirements.
Q4: What is the minimum order quantity?
A: Standard MOQ is 100 pieces. Contact us for smaller quantity options.
Q5: Why is your copper's thermal conductivity higher than others?
A: 401W/mK is standard for high-purity, oxygen-free copper, ensuring superior performance compared to standard thermal pads.
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